1. Dual in-line DIP

As the name implies, DIP (dual in-line) means that two rows of pins (dual in-line) can be directly inserted into the circuit for use (in-line). Generally, there will be a number at the end such as "DIP40" which means there are 40 pins in total. The characteristic of DIP is that it can be plugged and unplugged repeatedly (the learning board will also be equipped with sockets), but it is larger than other package formats, and is generally used for experiments, learning, manual soldering, and repeated plugging and reuse.

2. SMD PLCC and TQFP

Both PLCC and TQFP packaging formats are used for PCB patch packaging. The volume is much smaller than DIP, and most of them are square. The main difference between the two is that the PLCC pins are folded inward (left picture), and the TQFP pins are folded outward (right picture). Relatively speaking, PLCC is easy to reuse (so it can be equipped with sockets), and TQFP is more suitable for mass production.

3. Miniaturization of DIP: SOP, TSOP

SOP and DIP packages are a bit similar, both have two rows of pins, but SOP is much smaller than DIP, and the pins are folded outward for industrial production. TSOP is a smaller and flatter package than SOP. In the figure below, the left side is SOP, and the right side is TSOP.

Fourth, ultra-large-scale packaging PQFP

As mentioned earlier, using TQFP package pins to fold outwards is convenient for automated production, but TQFP generally has only dozens of pins, and some chips may have hundreds of pins. At this time, the package format used is called PQFP (pins similar to TQFP) Is folded outward).

5. Smaller, thinner and more powerful BGA

The BGA package puts the pins on the bottom of the chip, and its advantages are smaller and thinner, and better heat dissipation performance, but it is generally used for very large scale integrated circuits.

Similar to BGA, there are LGA and PGA. The principle is similar but the bottom pins are different. BGA is a ball pin, LGA is a chip pin, and PGA is a pin pin. Because BGA, LGA and PGA cannot be soldered, corresponding sockets are required.

 
Six, summary

In actual applications, there will be some variants of package types that will not be introduced one by one, but the package itself has no advantages or disadvantages, but has its own characteristics in different scenarios. However, several packaging formats are a bit confusing for novices, so here I have prepared information on various packaging formats of 51 single-chip microcomputers for you to compare and learn.

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